Please use this identifier to cite or link to this item: http://hdl.handle.net/10071/21330
Full metadata record
DC FieldValueLanguage
dc.contributor.authorAndrusca, M.-
dc.contributor.authorAdam, M.-
dc.contributor.authorDragomir, A.-
dc.contributor.authorLunca, E.-
dc.contributor.authorSeeram, R.-
dc.contributor.authorPostolache, O.-
dc.date.accessioned2021-01-18T14:43:28Z-
dc.date.available2021-01-18T14:43:28Z-
dc.date.issued2020-
dc.identifier.issn2076-3417-
dc.identifier.urihttp://hdl.handle.net/10071/21330-
dc.description.abstractNowadays, sensors and condition monitoring systems are expanding rapidly and becoming cheaper. This contributes to increasing developments in condition monitoring in railway transport infrastructure. A condition monitoring system that uses an online device and sensors to acquire electrical parameters from railway infrastructure has been developed and applied for fault detection and diagnosis of impedance bonds. The impedance bond condition is monitored in real-time using current and temperature sensors, providing early warning if predefined thresholds are exceeded in terms of currents, imbalance currents, and temperatures. The proposed method and the developed monitoring device have been validated in the railway laboratory to confirm its capability to detect defects. The acquired parameters from impedance bonds are used to extract thermal stresses and technical conditions of this equipment. Experimental results and appropriate data analysis are included in the article.eng
dc.language.isoeng-
dc.publisherMDPI-
dc.relation9PFE/2018-
dc.rightsopenAccess-
dc.subjectReturn circuiteng
dc.subjectMonitoring deviceeng
dc.subjectSensorseng
dc.subjectDiagnosiseng
dc.subjectThermal stresseng
dc.titleCondition monitoring system and faults detection for impedance bonds from railway infrastructureeng
dc.typearticle-
dc.peerreviewedyes-
dc.journalApplied Sciences-
dc.volume10-
dc.number18-
degois.publication.issue18-
degois.publication.titleCondition monitoring system and faults detection for impedance bonds from railway infrastructureeng
dc.date.updated2021-01-18T14:40:19Z-
dc.description.versioninfo:eu-repo/semantics/publishedVersion-
dc.identifier.doi10.3390/app10186167-
dc.subject.fosDomínio/Área Científica::Ciências Naturais::Ciências da Computação e da Informaçãopor
dc.subject.fosDomínio/Área Científica::Ciências Naturais::Ciências Físicaspor
dc.subject.fosDomínio/Área Científica::Ciências Naturais::Ciências Químicaspor
dc.subject.fosDomínio/Área Científica::Ciências Naturais::Outras Ciências Naturaispor
dc.subject.fosDomínio/Área Científica::Engenharia e Tecnologia::Engenharia Civilpor
dc.subject.fosDomínio/Área Científica::Engenharia e Tecnologia::Engenharia Químicapor
dc.subject.fosDomínio/Área Científica::Engenharia e Tecnologia::Engenharia dos Materiaispor
iscte.identifier.cienciahttps://ciencia.iscte-iul.pt/id/ci-pub-78174-
iscte.alternateIdentifiers.wosWOS:000580382900001-
Appears in Collections:IT-RI - Artigos em revistas científicas internacionais com arbitragem científica

Files in This Item:
File Description SizeFormat 
applsci-10-06167.pdfVersão Editora2,94 MBAdobe PDFView/Open


FacebookTwitterDeliciousLinkedInDiggGoogle BookmarksMySpaceOrkut
Formato BibTex mendeley Endnote Logotipo do DeGóis Logotipo do Orcid 

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.